Thermal Level Customization

Overview

Introduction

By default, OpenHarmony provides the thermal level feature. Different hardware devices generate different amounts of heat and can tolerate different maximum temperatures. Therefore, for different components, the thermal level standard needs to be defined based on their temperatures to clearly indicate the thermal status and provide input for thermal control. However, the thermal level of components at different temperatures varies according to product specifications. To address this issue, OpenHarmony provides the thermal level customization function.

Constraints

The configuration path for battery level customization is subject to the configuration policy. In this development guide, /vendor is used as an example of the configuration path. During actual development, you need to modify the customization path based on the product configuration policy.

How to Develop

Setting Up the Environment

Hardware requirements:

Development board running the standard system, for example, the DAYU200 or Hi3516D V300 open source suite.

Environment requirements:

For details about the requirements on the Linux environment, see Quick Start.

Getting Started with Development

The following uses DAYU200 as an example to illustrate thermal level customization.

1. Create the thermal folder in the product directory /vendor/hihope/rk3568.

2. Create a target folder by referring to the default thermal level configuration folder, and install it in //vendor/hihope/rk3568/thermal. The content is as follows:

   profile
   ├── BUILD.gn
   ├── thermal_service_config.xml
   

3. Write the custom thermal_service_config.xml file by referring to the thermal_service_config.xml file in the default thermal level configuration folder. The following tables describe the related configuration items.

   Table 1 Description of the base configuration

**Table 2** Description of the sensor_cluster configuration

**Table 3** Description of the item configuration

```shell
<thermal version="0.01" product="lya">
<base>
    <item tag="history_temp_count" value="10"/>
    <item tag="temperature_query_enum" value="soc,battery,shell,cpu,charger,ambient,ap,pa"/>
</base>

<level>
    <sensor_cluster name="base_safe" sensor="battery,charger,cpu,soc">
        <item level="1" threshold="42000,40000,30000,40000" threshold_clr="38000,36000,28000,38000"/>
        <item level="2" threshold="43000,41000,32000,42000" threshold_clr="41000,39000,30000,40000"/>
        <item level="3" threshold="46000,44000,34000,44000" threshold_clr="44000,42000,32000,42000"/>
        <item level="4" threshold="48000,46000,36000,46000" threshold_clr="46000,44000,34000,44000"/>
    </sensor_cluster>
</level>
```

4. Write the BUILD.gn file by referring to the BUILD.gn file in the default thermal level configuration folder to pack the thermal_service_config.xml file to the /vendor/etc/thermal_config directory. The configuration is as follows:

   import("//build/ohos.gni")                      # Reference build/ohos.gni.
   
   ohos_prebuilt_etc("thermal_service_config") {
       source = "thermal_service_config.xml"
       relative_install_dir = "thermal_config"
       install_images = [ chipset_base_dir ]       # Required configuration for installing the thermal_service_config.xml file in the vendor directory.
       part_name = "product_rk3568"                # Set part_name to product_rk3568 for subsequent build. You can change it as required.
   }
   

5. Add the build target to module_list in ohos.build in the /vendor/hihope/rk3568 directory. For example:

   {
       "parts": {
           "product_rk3568": {
               "module_list": [
                   "//vendor/hihope/rk3568/default_app_config:default_app_config",
                   "//vendor/hihope/rk3568/image_conf:custom_image_conf",
                   "//vendor/hihope/rk3568/preinstall-config:preinstall-config",
                   "//vendor/hihope/rk3568/resourceschedule:resourceschedule",
                   "//vendor/hihope/rk3568/etc:product_etc_conf",
                   "//vendor/hihope/rk3568/thermal/profile:thermal_service_config", // Add the configuration for building of thermal_service_config.
               ]
           }
       },
       "subsystem": "product_hihope"
   }
   

   In the preceding code, //vendor/hihope/rk3568/thermal/ is the folder path, profile is the folder name, and thermal_service_config is the build target.

6. Build the customized version by referring to Quick Start.

   ./build.sh --product-name rk3568 --ccache
   

7. Burn the customized version to the DAYU200 development board.

Debugging and Verification

1. After startup, run the following command to launch the shell command line:

   hdc shell
   

2. Go to the data/service/el0/thermal/sensor/soc/ directory.

   cd data/service/el0/thermal/sensor/soc
   

3. Change the SOC temperature.

   echo 42000 > temp
   

4. Obtain the current thermal level information.

   hidumper -s 3303 -a -l
   

   The following is the reference thermal level information after customization:

   -------------------------------[ability]-------------------------------
   
   
   ----------------------------------ThermalService---------------------------------
   name: base_safe	level: 2
   name: cold_safe	level: 0
   name: high_safe	level: 0
   name: warm_5G	level: 0
   name: warm_safe	level: 1
   

Reference

During development, you can refer to the default thermal level configuration.

Packing path: /vendor/etc/thermal_config/hdf